Leesys Portfolio

Do as others do: Choose Leesys as your powerful and cost-efficient Electronics Manufacturing partner next-door! With the background of almost 100 years of electronic manufacturing experience we produce PCB assemblies and complete devices following our vision: Secure hardware for secure communication.

 

Development

PCB Manufacturing

  • Hardware
  • Circuit design
  • Board development
  • Hardware based programming
  • Production oriented qualification of components
  • Component optimization
  • Re-Design and layout optimization
  • EMC simulation
  • EMC testing
  • Software development
  • Housing design and development
  • Manufacturing of prototypes and samples
  • Test case and use case development
  • Design For Manufacturing (DFM)
  • Design For Test (DFT)
  • Design To Cost (DTC )
  • Project management
  • Design FMEA, PPAP, APQP
  • Surface Mounted Technology (SMT)

          – laser marking
          – stencil printing
          – assembling of components 01005
          – QFP, BGA, FC-CSP, QFN, 0,4 mm Fine Pitch
          – inline programming
          – reflow soldering under protective gas (N)

  • Vapor phase soldering
  • Through Hole Technology (THT)

          – manual assembling
          – radial assembling
          – selective soldering, wave soldering, robots soldering

  • Depanelizing

          – sawing, milling, roll cutting

  • Product protection

          – finishing, sealing, underfilling

  • Traceability on component and board level