The World's Leading Trade Fair for Electronics Development and Production “productronica 2017” - Leesys was attending - 11/2017

Messestand "productronica"

International, innovative, unique: The “productronica” is the only event of its kind to showcase the entire value added chain of electronics development and production - from technologies to components and software up to services. Leesys presented itself with a new stand concept in hall B3.

 
Undoubtedly, electronics industry faces great challenges: New products with smaller and smaller component sizes are coming onto the market at ever shorter product lifecycle intervals. Only those companies who have mastered the latest and most complex technologies, reliably execute manufacturing and soldering processes, and automate their production facilities in order to ensure the best possible quality at the highest level of productivity, will create a sustainable business development.

Mr. Dr. Pastillé under discussion
showcase at "productronica"
agile interest at Leesys booth
Leesys showcase at "productronica"

This was also the basic tenor of the numerous talks that took place at the fair with customers and prospects of Leesys. The miniaturization also increases the demands on the processes. This has to be considered already in the development phase: The PCB layout does not only determine the integration density, it also significantly influences the later manufacturing processes. In production, stable process control becomes absolutely indispensable. And last but not least, manufacturing must be technically capable of implementing a high degree of miniaturization. Leesys has been working intensively on the subject of miniaturization for many years. As a result, the company has the skills and know-how along the entire value chain to ensure application-oriented solutions.

 
The talks have shown: There are numerous applications for miniaturization projects. From large-scale industrial controls, which are expected to shrink, to medical devices with advanced functions, to innovative, smallest sensor evaluations directly at the measuring point - the possibilities are manifold. If the development is then aligned with the manufacturing process, the chances of success for your miniaturized assembly are very good.

 
We are looking forward to the implementation of the new challenges and look forward to many new projects with our customers.
Thanks for your visit. We look forward to seeing you again at the “electronica” fair from 13th to 16th November 2018 in Munich.