The requirements in the crucial production process of PCB de-paneling are high.
On the one hand, manufacturers have to integrate de-paneling processes with minimal mechanical stress, and on the other hand, these processes should be linked intelligently with the directly connected "sorting" and "packaging" steps. Individual solutions according to cost and quality requirements are therefore more in demand for this process than ever before.
A so-called PCB panel consists of one or more, mostly identical printed circuit boards (PCB), which are connected to each other either completely or only via residual webs. The production of electronic assemblies is made for production reasons in the panels. The advantages are obvious: Handling is easier, production costs are lower and the whole logistical chain can be organized more cheaply. At the end of the production process there is always the de-paneling of the single PCBs, this means the individual circuit boards must be separated from the panels. So far, tools such as punching, rolling blades or shears are used here. However, these tools and methods exert a great deal of mechanical stress on the assemblies. This inevitably leads to restrictions in the layout. An edge assembly of components is excluded with such methods.
Due to the trend towards miniaturization of printed circuit boards as well as the increasing quality requirements, many customers expect from the suppliers new methods for the separation of printed circuit boards from a panel. Many processors of printed circuit boards, such as suppliers in the automotive industry, are already prescribing the use of low-stress separation processes. By minimizing mechanical stress on the circuit board when disconnecting error rates are to be significantly reduced. Automatic cut-to-size machines based on milling (end milling cutters) are therefore state-of-the-art today.
FULLY AUTOMATED DE-PANELING OF SINGLE PCB IN HIGHEST PRECISION
As part of these requirements, Leesys has invested in a flexible high-speed de-paneling system "DIVISIO 5100" from the ASYS Group. Fully automated processes can be realized with this "separation unit". The assembled printed circuit boards can be fed in a printed circuit board magazine. The PCBs are separated from the panel, checked for dimensional accuracy, cleaned if necessary with ionized, fluidized air and - taking into account the good / bad information from the MES system - packed in a tray. Incorrect sorting by the operator can thus be ruled out by the completely automated process. An autonomous tool and gripper change ensures excellent availability and increases the autonomy of the system.
ALL DETAILS AT A GLANCE
With the following functions, the de-paneling system increases productivity and meets current and future quality requirements:
- Fully automated processing from the panel in the magazine to the individual PCB in a tray
- Line motor axle systems for fast and precise processes
- Automatic tool change incl. smart tool management
- breakage control
- Diameter control
- Length control
- Service life monitoring
- Dynamic cutting zone utilization
- Automatic maintenance plan
- Automatic gripper change including gripper finger measurement
- Camera system for panel position correction and cutting position control
- Dust extraction with vacuum monitoring
- Cleaning system (ionized, turbulent air) with defined suction
"With this investment in a flexible, high-speed de-paneling center, we are meeting the requirements, in particular in the automotive industry, to an even greater extent. On the one hand, with one of the market's most modern and innovative machinery, we are one of the top ten Electronic Manufacturing Service providers in the German EMS industry. On the other hand, we face the growing challenges of our customers on a daily basis and are constantly moving forward in a continuous process of improvement with new technologies and processes", summarizes Jörg Friedrich, COO Leesys, the overall picture of the investment decision.