From May 16th to 18th, 2017 the SMT trade fair in Nuremberg focused again on: find appropriate solutions, make contacts with experts and discover trends. SMT Hybrid Packaging is the only event in Europe to consider system integration in microelectronics with a holistic approach.
Beginning with the first idea through the development to the production, the exhibition shows all the technical processes involved in the production of electronic assemblies.
Leesys can look back on a very successful exhibition. "The SMT Hybrid Packaging 2017 was very successful for us. In particular, the quality and the good level of conversations with new contacts and manufacturing experts impressed us and showed us that we are very well represented as a competent electronics manufacturer in the market", says Stefan Salesch, Head of Sales of Leesys - Leipzig Electronic Systems GmbH.
For three days, many good discussions with customers were held and numerous new contacts were made.
We would like to thank the visitors for their interest in our booth!